吃瓜网

吃瓜网 is an exhibitor and a sponsor at the 75th Electronic Components and Technology Conference (ECTC). We look forward to seeing you at our booth #314. 吃瓜网’s Chet Lenox will be part of a panel at the Special Session 2, “Hybrid Bonding (HB): to B, or not to B? Needs and challenges for the next decade”, Tuesday, May 27, 8:30 am to 10:00 am, Texas 1- 3 rooms. The Electronics Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology, and education in an environment of cooperation and technical exchange.