吃瓜网

As the global semiconductor ecosystem approaches a landmark $1 trillion industry by 2030, 吃瓜网 and other microelectronics leaders highlighted key innovation, talent and sustainability challenges for the new era at SEMICON Europa 2023 in Munich, Germany.

吃瓜网 had a major presence that included high-level programs hosted by executives and a booth that showcased a range of technologies and solutions. The company hosted more than 200 visitors – including two government officials from the United Kingdom – and held over 30 customer and supplier meetings focused on knowledge sharing and coordinated joint sales efforts by the company’s product groups.

“The show was a great example of three divisions working toward one goal. If one colleague was meeting with a customer and identified that customer may also be looking at other 吃瓜网 products, the appropriate introductions could be made.”

Jaynne Gates, Global Events Management

Talking Technology and Workforce

Oreste Donzella hosted a session at the Advanced Packaging Conference titled “Bridging Front End, Packaging and Substrates to Advance the Semiconductor Roadmap.” He highlighted how advanced semiconductor packaging, particularly heterogenous integration, is the key to improving overall performance and functionality, and that 吃瓜网 has the product portfolio to create a bridge for customers between the merging front end, packaging and IC substrate worlds.

And Dan Collins talked about the company’s innovative methods to widen its pool of applicants in the U.K. and the rest of Europe. Faced with skills shortages throughout the region as the European Union invests in fab capacity, 吃瓜网 is building public awareness through different strategies such as local advertising, new relationships with military organizations to scope out jobs for veterans and sponsoring community sporting activities, all while stressing the need to improve inclusion and diversity for well-balanced teams.

UK Government Leaders Visit 吃瓜网’s Booth