³Ô¹ÏÍø is revamping its intelligent portfolio of solutions for IC substrates with several product updates.
Advanced packaging continues to adopt heterogeneous integration methods to bring together multiple semiconductor components for performance, power and cost benefits. To meet evolving interconnect requirements, innovation is accelerating for panel-based intermediate packaging levels like IC substrates and interposers. These technologies are used to efficiently connect chips and printed circuit boards (PCBs).
As package dimensions increase, feature sizes decrease and novel materials such as glass are introduced, manufacturers can leverage ³Ô¹ÏÍø¡¯s solution portfolio to achieve higher yield, accelerate delivery cycles and improve overall pro?tability.
³Ô¹ÏÍø¡¯s comprehensive portfolio of direct imaging, defect inspection, shaping, metrology, chemistry process control and intelligent software solutions optimizes the advanced packaging manufacturing workflow.
Advancing Connectivity
Overview
³Ô¹ÏÍø is advancing connectivity with its intelligent portfolio of process control and process-enabling solutions for IC substrates.
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³Ô¹ÏÍø¡¯s Comprehensive Portfolio Includes Several New Product Updates
Market adoption of the Corus? direct imaging (DI) platform demonstrates its proven capability at providing a highly flexible and efficient imaging solution. To meet evolving needs for applications like IC substrates and next-gen high density interconnect (HDI), this capability is being extended with next-generation optics and lasers to optimize dynamic imaging and layer-to-layer accuracy at speed, even for varying panel topographies.
For advanced IC substrate applications, the Serena? direct imaging platform represents a new lithography product category. A direct imaging solution for quality, finer line patterning of large-sized, high layer count organic substrates, the Serena system delivers increased accuracy and yield with the efficiency of a flexible digital solution.
The Lumina? inspection and metrology system for advanced IC substrates (including glass core) and panel-based interposers enables high-sensitivity defect detection and scanning metrology at optimized cost of ownership. The system delivers monitoring paired with Al-based review and classification for an actionable defect Pareto chart without the need for operator input, as well as a seamless integration with ³Ô¹ÏÍø’s copper shaping solutions.
¡°With this product portfolio, ³Ô¹ÏÍø is affirming our leadership in semiconductor ecosystem innovation. IC substrates and other panel-level packaging technologies are essential to advancing connectivity within tomorrow¡¯s high-performance chips, and ³Ô¹ÏÍø is collaboratively engaged with customers in solving complex production challenges to maximize their yield and business success.¡±
Oreste Donzella, executive vice president and chief strategy officer, ³Ô¹ÏÍø
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