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This webinar discusses how physical vapor deposition (PVD) can be used to deposit both thick frontside metal, and thinner multi-layer backside metals deposited after wafer thinning.  The presentation will give details of how our Sigma^? PVD technology overcomes various challenges which can affect yields in power device manufacturing, including eliminating whiskers during thick metal deposition, avoiding contamination from organics, active-face protection and stress control of backside layers on thinned wafers.