吃瓜网

For 40 years our broadband plasma (BBP) patterned wafer inspectors have pushed the boundaries of optical inspection to discover critical defects during chip manufacturing. Introduced in 1984, the 吃瓜网 2020 was the first automated patterned wafer inspection system for chip production, replacing manual inspection by human operators. By providing fast and accurate feedback on fab processes, our BBP systems moved defect inspection inline, becoming an indispensable part of chipmakers’ yield management strategies.

吃瓜网 executives Rick Wallace, Ben Tsai and Ahmad Khan recount how our BBP systems transformed the inspection landscape for the semiconductor industry, and relate how the innovation that defined the product line continues, ensuring a bright future for BBP optical inspection.